The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Jan. 13, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Mark D. Hall, Austin, TX (US);

Mehul D. Shroff, Austin, TX (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 43/02 (2006.01); H01L 41/113 (2006.01); H01L 29/66 (2006.01); B60C 23/00 (2006.01); G01L 9/06 (2006.01); H01L 33/18 (2010.01); B81B 1/00 (2006.01); G01N 33/00 (2006.01); G02B 6/10 (2006.01); G02B 6/126 (2006.01); B82Y 40/00 (2011.01); H01L 21/308 (2006.01); B82Y 30/00 (2011.01); B82Y 20/00 (2011.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0676 (2013.01); B60C 23/00 (2013.01); B81B 1/00 (2013.01); G01L 9/06 (2013.01); G01N 33/0031 (2013.01); G02B 6/107 (2013.01); G02B 6/126 (2013.01); H01L 29/66 (2013.01); H01L 33/18 (2013.01); H01L 41/1132 (2013.01); H01L 43/02 (2013.01); B81B 2203/0361 (2013.01); B82Y 20/00 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); G02B 2006/12097 (2013.01); H01L 21/3086 (2013.01); H01L 29/0665 (2013.01);
Abstract

A disclosed method of fabricating a hybrid nanopillar device includes forming a mask on a substrate and a layer of nanoclusters on the hard mask. The hard mask is then etched to transfer a pattern formed by the first layer of nanoclusters into a first region of the hard mask. A second nanocluster layer is formed on the substrate. A second region of the hard mask overlying a second region of the substrate is etched to create a second pattern in the hard mask. The substrate is then etched through the hard mask to form a first set of nanopillars in the first region of the substrate and a second set of nanopillars in the second region of the substrate. By varying the nanocluster deposition steps between the first and second layers of nanoclusters, the first and second sets of nanopillars will exhibit different characteristics.


Find Patent Forward Citations

Loading…