The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2017
Filed:
May. 23, 2016
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Benjamen M. Rathsack, Austin, TX (US);
Mark H. Somervell, Austin, TX (US);
Assignee:
Tokyo ELectron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/00 (2006.01); G03F 7/42 (2006.01); H01L 21/311 (2006.01); G03F 7/16 (2006.01); G03F 7/40 (2006.01); H01L 21/308 (2006.01); H01L 21/027 (2006.01); G03F 7/09 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); G03F 7/091 (2013.01); G03F 7/165 (2013.01); G03F 7/40 (2013.01); G03F 7/42 (2013.01); H01L 21/0273 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/3088 (2013.01); H01L 21/31116 (2013.01); H01L 21/32139 (2013.01);
Abstract
A method is provided for forming a patterned topography on a substrate. The substrate is provided with features formed atop that constitute an existing topography, and a template for directed self-assembly (DSA) surrounds the exposed topography. Further to the method, the template is filled with a block copolymer (BCP) to cover the exposed topography, and then the BCP is annealed within the template to drive self-assembly in alignment with the topography. Developing the annealed BCP exposes a DSA pattern immediately overlying the topography.