The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

May. 09, 2008
Applicants:

Scott T. Sheppard, Chapel Hill, NC (US);

R. Peter Smith, Carrboro, NC (US);

Yifeng Wu, Goleta, CA (US);

Sten Heikman, Goleta, CA (US);

Matthew Jacob-mitos, Santa Barbara, CA (US);

Inventors:

Scott T. Sheppard, Chapel Hill, NC (US);

R. Peter Smith, Carrboro, NC (US);

Yifeng Wu, Goleta, CA (US);

Sten Heikman, Goleta, CA (US);

Matthew Jacob-Mitos, Santa Barbara, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 29/778 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 29/0843 (2013.01); H01L 29/66462 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 29/2003 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Methods of forming a semiconductor device include forming a dielectric layer on a Group III-nitride semiconductor layer, selectively removing portions of the dielectric layer over spaced apart source and drain regions of the semiconductor layer, implanting ions having a first conductivity type directly into the source and drain regions of the semiconductor layer, annealing the semiconductor layer and the dielectric layer to activate the implanted ions, and forming metal contacts on the source and drain regions of the semiconductor layer.


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