The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Sep. 24, 2014
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Gia-Her Lu, Hsinchu County, TW;
Liang-Chen Lin, Hsinchu County, TW;
Tung-Chin Yeh, Miaoli County, TW;
Jyun-Lin Wu, Hsinchu, TW;
Tung-Jiun Wu, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes a semiconductor substrate including a plurality of through substrate vias (TSV) extending from a first surface to a second surface of the semiconductor substrate, wherein the second surface is opposite to the first surface; a plurality of conductive bumps on the second surface and connected to a corresponding TSV; a polymeric layer on the second surface and surrounding a lower portion of a corresponding conductive bump. The polymeric layer includes a first portion configured as a blanket covering a periphery region of the semiconductor substrate; and a second portion in a core region of the semiconductor substrate and configured as a plurality of isolated belts, wherein each of the isolated belts surrounds a corresponding conductive bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile