The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jul. 11, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kevin K. Chan, Staten Island, NY (US);

Young-Hee Kim, Mohegan Lake, NY (US);

Masaharu Kobayashi, Yorktown Heights, NY (US);

Jinghong Li, Poughquag, NY (US);

Dae-Gyu Park, Poughquag, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/84 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 27/12 (2006.01); H01L 21/02 (2006.01); H01L 21/16 (2006.01); H01L 21/265 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/845 (2013.01); H01L 21/02524 (2013.01); H01L 21/02529 (2013.01); H01L 21/02532 (2013.01); H01L 21/02598 (2013.01); H01L 21/02636 (2013.01); H01L 21/165 (2013.01); H01L 21/26513 (2013.01); H01L 27/1211 (2013.01); H01L 29/0649 (2013.01); H01L 29/1054 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7849 (2013.01);
Abstract

A semiconductor fin including a single crystalline semiconductor material is formed on a dielectric layer. A semiconductor shell including an epitaxial semiconductor material is formed on all physically exposed surfaces of the semiconductor fin by selective epitaxy, which deposits the semiconductor material only on semiconductor surfaces and not on dielectric surfaces. The epitaxial semiconductor material can be different from the single crystalline semiconductor material, and the semiconductor shell can be bilaterally strained due to lattice mismatch. A fin field effect transistor including a strained channel can be formed. Further, the semiconductor shell can advantageously alter properties of the source and drain regions, for example, by allowing incorporation of more dopants or by facilitating a metallization process.


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