The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Nov. 16, 2015
Applicant:
Polyera Corporation, Skokie, IL (US);
Inventors:
Shaofeng Lu, Wilmette, IL (US);
Daniel Batzel, Skokie, IL (US);
Chun Huang, Arlington Heights, IL (US);
Minhuei Wang, Kaohsiung, TW;
Meko McCray, Chicago, IL (US);
Yu Xia, Northbrook, IL (US);
Antonio Facchetti, Chicago, IL (US);
Assignee:
Flexterra, Inc., Skokie, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08G 61/04 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); G03F 7/038 (2006.01); C08G 65/40 (2006.01); C08G 65/48 (2006.01); G03F 7/004 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78606 (2013.01); C08G 65/4006 (2013.01); C08G 65/48 (2013.01); G03F 7/0046 (2013.01); G03F 7/038 (2013.01); G03F 7/0382 (2013.01); G03F 7/0384 (2013.01); G03F 7/0388 (2013.01); H01L 27/127 (2013.01); H01L 27/1225 (2013.01); H01L 27/1288 (2013.01); H01L 29/66742 (2013.01); H01L 29/7869 (2013.01); H01L 29/78696 (2013.01);
Abstract
The present polymeric materials can be patterned with relatively low photo-exposure energies and are thermally stable, mechanically robust, resist water penetration, and show good adhesion to metal oxides, metals, metal alloys, as well as organic materials. In addition, these polymeric materials can be solution-processed (e.g., by spin-coating), and can exhibit good chemical (e.g., solvent and etchant) resistance in the cured form.