The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9704793 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 11, 2017

Filed:

Dec. 07, 2011
Applicants:

Shigenobu Sekine, Tokyo, JP;

Yurina Sekine, Tokyo, JP;

Inventors:

Shigenobu Sekine, Tokyo, JP;

Yurina Sekine, Tokyo, JP;

Assignee:

NAPRA CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 23/3677 (2013.01); H01L 33/642 (2013.01); H01L 33/486 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.


Find Patent Forward Citations

Sekine, Shigenobu. (2017). Substrate for electronic device and electronic device (U.S. Patent No. 9704793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9704793

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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