The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Dec. 19, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jeffrey S Leib, Hillsboro, OR (US);
Ralph T Troeger, Portland, OR (US);
Daniel Bergstrom, Lake Oswego, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 21/285 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/2855 (2013.01); H01L 21/28568 (2013.01); H01L 21/76865 (2013.01); H01L 21/76883 (2013.01); H01L 23/528 (2013.01); H01L 23/535 (2013.01); H01L 23/53266 (2013.01); H01L 29/41791 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 2029/7858 (2013.01);
Abstract
Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.