The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Feb. 19, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Han-Hum Park, Suwon-si, KR;

Sung-Won Choi, Yongin-si, KR;

Chang-Ho Han, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); G05B 19/402 (2006.01); G03F 7/20 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G05B 19/402 (2013.01); G03F 7/70633 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G05B 2219/45031 (2013.01);
Abstract

A method for fabricating a semiconductor device includes obtaining first raw data by measuring an overlay of a semiconductor wafer of a first lot and generating a regression equation based on the first raw data. A semiconductor wafer of a second lot is aligned based on a coefficient of the regression equation, second raw data is obtained by measuring an overlay of the aligned semiconductor wafer of the second lot, and the regression equation is corrected based on the second raw data. Correction of the regression equation includes dividing the regression equation into an initial equation and a residual equation excluding the initial equation from the regression equation, correcting a coefficient of the initial equation; and correcting a coefficient of the residual equation.


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