The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Nov. 15, 2016
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Satoru Nakamura, Albany, NY (US);

Akiteru Ko, Schenectady, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32082 (2013.01); H01J 37/3244 (2013.01); H01J 37/32532 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/67069 (2013.01); H01J 2237/334 (2013.01);
Abstract

Provided is a method of plasma etching on a substrate using an etchant gas mixture to meet integration objectives, the method comprising: disposing a substrate having a structure pattern layer, a neutral layer, and an underlying layer, the structure pattern layer comprising a first material and a second material and the underlying layer comprising a silicon anti-reflective (SiARC) layer, a spin-on carbon hardmask (CHM) layer, an oxide layer, and a target layer; performing an first etch process to selectively remove the second material and the neutral layer using a first etchant gas mixture to form a first pattern; performing an second etch process to selectively remove the SiARC layer to form a second pattern; performing an third etch process to selectively remove the CHM layer to form a third pattern; concurrently controlling selected two or more operating variables wherein the first etchant gas include oxygen and sulfur-containing gases.


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Nakamura, Satoru. (2017). Etching method for a structure pattern layer having a first material and second material (U.S. Patent No. 9697990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9697990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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