The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jun. 07, 2016
United Microelectronics Corp., Hsinchu, TW;
Kuo-Chih Lai, Tainan, TW;
Chia-Chang Hsu, Kaohsiung, TW;
Nien-Ting Ho, Tainan, TW;
Ching-Yun Chang, Tainan, TW;
Yen-Chen Chen, Tainan, TW;
Shih-Min Chou, Tainan, TW;
Yun-Tzu Chang, Kaohsiung, TW;
Yang-Ju Lu, Changhua, TW;
Wei-Ming Hsiao, Miaoli County, TW;
Wei-Ning Chen, Tainan, TW;
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Abstract
A semiconductor structure comprises a first wire level, a second wire level and a via level. The first wire level comprises a first conductive feature. The second wire level is disposed on the first wire level. The second wire level comprises a second conductive feature and a third conductive feature. The via level is disposed between the first wire level and the second wire level. The via level comprises a via connecting the first conductive feature and the second conductive feature. There is a first air gap between the first conductive feature and the second conductive feature. There is a second air gap between the second conductive feature and the third conductive feature. The first air gap and the second air gap are linked.