The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Apr. 30, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ching-Fang Chen, Taichung, TW;

Hsiang-Tai Lu, Zhubei, TW;

Chih-Hsien Lin, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2856 (2013.01); G01R 31/2886 (2013.01);
Abstract

A method of testing a three-dimensional integrated circuit (3DIC) includes applying a voltage through at least one testing element and at least one conductive line, wherein the at least one conductive line traces a perimeter of at least one of a top chip or an interposer substantially parallel to an outer edge of the at least one top chip or the interposer, and the at least one conductive line is configured to electrically connect a plurality of conductive connectors. The method further includes measuring a current responsive to the applied voltage. The method further includes determining an integrity of the 3DIC based on the measured current.


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