The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Jul. 17, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ying-Jie Cai, Hsinchu, TW;

Bo-Wei Chou, Hsinchu, TW;

Shih-Hsing Kao, Hsinchu, TW;

Shin-Hsien Yang, Tainan, TW;

Tzu-Min Lee, New Taipei, TW;

Tai-Yung Yu, Tainan, TW;

Wen-Cheng Lien, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/00 (2006.01); B08B 3/02 (2006.01); H01L 21/02 (2006.01); B08B 3/08 (2006.01);
U.S. Cl.
CPC ...
B08B 3/02 (2013.01); B08B 3/024 (2013.01); B08B 3/08 (2013.01); H01L 21/02052 (2013.01);
Abstract

Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.


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