The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Dec. 18, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Jonathan D. Chapple-Sokol, Essex Junction, VT (US);
Cathryn J. Christiansen, Huntington, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Tom C. Lee, Essex Junction, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Anthony K. Stamper, Williston, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76846 (2013.01); H01L 21/76858 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Approaches for providing a liner at a via-to-wire interface are provided. A method includes: forming a via opening that exposes an upper surface of a copper wire; forming a titanium liner on the upper surface of the wire; forming a tungsten liner on the titanium liner; and forming a via on the second liner in the via opening.