The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Jul. 18, 2014
Applicant:
Leo M. Higgins, Iii, Austin, TX (US);
Inventor:
Leo M. Higgins, III, Austin, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4889 (2013.01); H01L 23/3142 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/3107 (2013.01); H01L 23/49551 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83444 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A method and apparatus are described for fabricating a microchip structure () which protects interior electrical integrated circuits and components () attached to a lead frame die flag () using a molding compound () that mechanically interlocks with one or more positive mold lock structures formed as dummy wire loops () or stud bumps () that are attached to the lead frame () and/or die flag ().
Higgins, III, Leo. (2017). Wire bond mold lock method and structure (U.S. Patent No. 9685351). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9685351
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile