The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Nov. 13, 2003
Haruki Nojo, Kanagawa, JP;
Akitoshi Yoshida, Chiba, JP;
Hirofumi Kashihara, Kanagawa, JP;
Pascal Berar, Hayward, CA (US);
Haruki Nojo, Kanagawa, JP;
Akitoshi Yoshida, Chiba, JP;
Hirofumi Kashihara, Kanagawa, JP;
Pascal Berar, Hayward, CA (US);
Air Products and Chemicals, Inc., Allentown, PA (US);
Abstract
To provide a polishing slurry composition which effectively reduces the occurrence of scratches, and a method of polishing which reduces the occurrence of scratches while realizing an economical polishing step. The aforementioned object is attained by using a polishing slurry composition for polishing a semiconductor substrate containing a metal oxide particle, at least one water-soluble organic polymer and water, said slurry composition characterized in that, when a test substrate having a metal film, a shallow trench isolation film or dielectric film is polished by varying a rate of a polishing pad equipped in a polishing apparatus under a constant polishing pressure to achieve a maximum polishing rate.