The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Oct. 18, 2013
Applicants:

Stephen R. Hooper, Mesa, AZ (US);

Philip H. Bowles, Gilbert, AZ (US);

Inventors:

Stephen R. Hooper, Mesa, AZ (US);

Philip H. Bowles, Gilbert, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0074 (2013.01); B81C 1/00301 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01);
Abstract

Sensor device packages and related fabrication methods are provided. An exemplary sensor device package includes a first structure having a sensing arrangement thereon, a second structure having circuitry thereon, and a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure. Thus, circuitry on the second structure may be electrically connected to an interface of the sensor device package through the first structure.


Find Patent Forward Citations

Hooper, Stephen. (2017). Sensor device packages and related fabrication methods (U.S. Patent No. 9676611). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9676611

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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