The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9669514 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 06, 2017

Filed:

May. 29, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;

Inventors:

Jiun-Yu Lai, Taipei, TW;

Ying-Hsiu Tsai, Hsinchu, TW;

Wei-Chen Chang, Nantou, TW;

Yi-Ching Chiou, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 49/105 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 53/017 (2013.01);
Abstract

Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad.


Find Patent Forward Citations

Lai, Jiun-Yu. (2017). System and method for polishing substrate (U.S. Patent No. 9669514). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9669514

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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