The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Oct. 31, 2012
Applicant:
Infineon Technologies Ag;
Inventors:
Joachim Mahler, Regensburg, DE;
Edward Fuergut, Dasing, DE;
Khalil Hosseini, Weihmichl, DE;
Georg Meyer-Berg, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/291 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/296 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Described are techniques related to semiconductor devices that make use of encapsulant. In one implementation, a semiconductor device may be manufactured to include at least an encapsulant that includes at least glass particles.