The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Sep. 17, 2014
Applicant:

Ultratech, Inc., San Jose, CA (US);

Inventors:

Ganesh Sundaram, Concord, MA (US);

Andrew M. Hawryluk, Los Altos, CA (US);

Daniel Stearns, Los Altos Hills, CA (US);

Assignee:

Ultratech, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 31/0256 (2006.01); H01L 21/02 (2006.01); C23C 16/22 (2006.01); H01L 29/20 (2006.01); H01L 21/268 (2006.01); B23K 26/03 (2006.01); B23K 26/073 (2006.01); B23K 26/122 (2014.01); C23C 16/56 (2006.01); H01L 21/324 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); B23K 26/034 (2013.01); B23K 26/0738 (2013.01); B23K 26/122 (2013.01); C23C 16/22 (2013.01); C23C 16/56 (2013.01); H01L 21/0254 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02598 (2013.01); H01L 21/02675 (2013.01); H01L 21/02694 (2013.01); H01L 21/268 (2013.01); H01L 21/3245 (2013.01); H01L 29/2003 (2013.01); B23K 2203/56 (2015.10);
Abstract

Atomic Layer Deposition (ALD) is used for heteroepitaxial film growth at reaction temperatures ranging from 80-400° C. The substrate and film materials are preferably selected to take advantage of Domain Matched Epitaxy (DME). A laser annealing system is used to thermally anneal deposition layers after deposition by ALD. In preferred embodiments a silicon substrate is overlaid with an AIN nucleation layer and laser annealed. Thereafter a GaN device layers is applied over the AIN layer by an ALD process and then laser annealed. In a further example embodiment a transition layer is applied between the GaN device layer and the AIN nucleation layer. The transition layer comprises one or more different transition material layers each comprising a AlGacompound wherein the composition of the transition layer is continuously varied from AIN to GaN.


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