The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Sep. 02, 2014
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/20 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/203 (2013.01); B23K 1/20 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H05K 3/3436 (2013.01); B23K 1/0016 (2013.01); H01L 2224/03828 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/136 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/1317 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1362 (2013.01); H01L 2224/1366 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13138 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13149 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13605 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13613 (2013.01); H01L 2224/13616 (2013.01); H01L 2224/13617 (2013.01); H01L 2224/13618 (2013.01); H01L 2224/13624 (2013.01); H01L 2224/13638 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/13671 (2013.01); H01L 2924/3651 (2013.01); H01L 2924/384 (2013.01); H05K 2201/10234 (2013.01); H05K 2201/10621 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/041 (2013.01); Y02P 70/613 (2015.11);
Abstract
A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.