The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jan. 25, 2016
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Caleb C. Han, Sunnyvale, CA (US);
Jun Zhai, Cupertino, CA (US);
Tongbi T. Jiang, Santa Clara, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/14 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/10 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/14 (2013.01); H04R 1/1041 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); H04R 2201/107 (2013.01);
Abstract
MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.