The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Sep. 09, 2015
Applicant:

Headway Technologies, Inc., Milpitas, CA (US);

Inventors:

Rao Annapragada, Union City, CA (US);

Yu-Jen Wang, San Jose, CA (US);

Dongna Shen, San Jose, CA (US);

Assignee:

Headway Technologies, Inc., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 43/12 (2006.01); H01L 41/12 (2006.01); H01L 43/08 (2006.01); H01L 41/47 (2013.01); H01L 41/06 (2006.01); H01L 27/22 (2006.01); H01L 43/02 (2006.01);
U.S. Cl.
CPC ...
H01L 41/47 (2013.01); H01L 27/224 (2013.01); H01L 41/06 (2013.01); H01L 41/12 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/12 (2013.01);
Abstract

An improved method for etching a magnetic tunneling junction (MTJ) structure is achieved. A stack of MTJ layers is provided on a bottom electrode. The MTJ stack is patterned to form a MTJ device wherein sidewall damage or sidewall redeposition is formed on sidewalls of the MTJ device. A dielectric layer is deposited on the MTJ device and the bottom electrode. The dielectric layer is etched away using ion beam etching at an angle relative to vertical of greater than 50 degrees wherein the dielectric layer on the sidewalls is etched away and wherein sidewall damage or sidewall redeposition is also removed and wherein some of the dielectric layer remains on horizontal surfaces of the bottom electrode.


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