The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Feb. 12, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Chen-Hua Yu, Hsin-Chu, TW;
Dean Wang, Tainan, TW;
Chen-Shien Chen, Zhubei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Jiun Yi Wu, Zhongli, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/764 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 21/764 (2013.01); H01L 23/295 (2013.01); H01L 23/315 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/80 (2013.01); H01L 24/92 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die.