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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9659878 B1

PDFFull Text
Expired
Date of Patent:
May. 23, 2017

Filed:

Oct. 20, 2015

Wafer level shielding in multi-stacked fan out packages and methods of forming same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Wei-Yu Chen, New Taipei, TW;

Hsien-Wei Chen, Hsin-Chu, TW;

An-Jhih Su, Bade, TW;

Jo-Mei Wang, New Taipei, TW;

Tien-Chung Yang, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Michael Lebentritt

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/29 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/3205 (2006.01); H01L 25/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/3205 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68359 (2013.01); H01L 2225/06548 (2013.01);
Abstract

An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic interference (EMI) shield disposed over and extending along sidewalls of the molding compound. The EMI shield contacts the conductive TIV, and the conductive TIV electrically connects the EMI shield to an external connector. The external connector and the EMI shield are disposed on opposing sides of the device die.

Find Patent Forward Citations

Quick Actions:

Chen, Wei-Yu. (2017). Wafer level shielding in multi-stacked fan out packages and methods of forming same (U.S. Patent No. 9659878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9659878

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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