The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

May. 11, 2015
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Vage Oganesian, Sunnyvale, CA (US);

Belgacem Haba, Saratoga, CA (US);

Craig Mitchell, San Jose, CA (US);

Ilyas Mohammed, Santa Clara, CA (US);

Piyush Savalia, San Jose, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01); H01L 25/11 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76819 (2013.01); H01L 21/76877 (2013.01); H01L 23/5389 (2013.01); H01L 24/18 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 25/117 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/4985 (2013.01); H01L 23/49827 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/24247 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1029 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.


Find Patent Forward Citations

Loading…