The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Nov. 11, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Marie Denison, Plano, TX (US);

Brian Ashley Carpenter, Cary, NC (US);

Osvaldo Jorge Lopez, Annandale, NJ (US);

Juan Alejandro Herbsommer, Allen, TX (US);

Jonathan Noquil, Bethlehem, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/50 (2013.01); H01L 21/561 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/49838 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40145 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract

A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the opposite chip surface. The common first terminal is attached to the substrate pad. The second terminals are connected by discrete first and second metal clips to respective substrate pins. A composite second chip has a third and a fourth transistor integrated so that the second terminals of the transistors are merged into a common terminal on one chip surface. Patterned first and third terminals are on the opposite chip surface. The second chip is flipped to be vertically attached with its first terminals to the first and second clips, respectively. The third terminals are connected by discrete clips to respective substrate pins. The common second terminal is connected by a common clip to a substrate pin.


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