The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jun. 12, 2015
Applicant:
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Inventors:
Hamza Yilmaz, Saratoga, CA (US);
Yan Xun Xue, Los Gatos, CA (US);
Jun Lu, San Jose, CA (US);
Ming-Chen Lu, Shanghai, CN;
Yan Huo, Shanghai, CN;
Aihua Lu, Shanghai, CN;
Assignee:
Alpha & Omega Semiconductor (Cayman), Ltd., Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/561 (2013.01); H01L 21/566 (2013.01); H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 24/14 (2013.01); H01L 24/97 (2013.01); H01L 21/6836 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and a plastic package body.