The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Nov. 19, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Hideaki Kawahara, Plano, TX (US);

Hong Yang, Richardson, TX (US);

Christopher Boguslaw Kocon, Mountain Top, PA (US);

Yufei Xiong, Chengdu, CN;

Yunlong Liu, Chengdu, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/28 (2006.01); H01L 21/765 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/94 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/28008 (2013.01); H01L 21/765 (2013.01); H01L 29/407 (2013.01); H01L 29/42368 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H01L 29/41766 (2013.01); H01L 29/945 (2013.01);
Abstract

A method of fabricating a semiconductor device includes etching a semiconductor substrate having a top surface to form a trench having sidewalls and a bottom surface that extends from the top surface into the semiconductor substrate. A dielectric liner of a first dielectric material is formed on the bottom surface and sidewalls of the trench to line the trench. A second dielectric layer of a second dielectric material is deposited to at least partially fill the trench. The second dielectric layer is partially etched to selectively remove the second dielectric layer from an upper portion of the trench while preserving the second dielectric layer on a lower portion of the trench. The trench is filled with a fill material which provides an electrical conductivity that is at least that of a semiconductor.


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