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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9646861 B1

PDFFull Text
Date of Patent:
May. 09, 2017

Filed:

Oct. 17, 2013

Heating plate with heating zones for substrate processing and method of use thereof

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Harmeet Singh, Fremont, CA (US);

Keith Gaff, Fremont, CA (US);

Neil Benjamin, East Palo Alto, CA (US);

Keith Comendant, Fremont, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:

Mark Paschall

Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 21/67 (2006.01); C23C 14/54 (2006.01); C23C 16/458 (2006.01); H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H05B 3/26 (2006.01); H05B 3/00 (2006.01); C23C 14/50 (2006.01); C23C 16/46 (2006.01); C23C 16/509 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); C23C 14/541 (2013.01); C23C 16/4586 (2013.01); H01J 37/32724 (2013.01); H01L 21/3065 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H05B 1/0233 (2013.01); H05B 3/00 (2013.01); H05B 3/26 (2013.01); C23C 14/50 (2013.01); C23C 16/46 (2013.01); C23C 16/509 (2013.01); H01J 37/32091 (2013.01); H01J 2237/327 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01); H01J 2237/3342 (2013.01); H01J 2237/3343 (2013.01); H01L 21/0262 (2013.01); H01L 21/02274 (2013.01); H01L 21/28556 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/32136 (2013.01); H01L 21/67109 (2013.01); Y10T 29/49083 (2015.01); Y10T 29/49099 (2015.01);
Abstract

A heating plate for use in a substrate support is configured to provide temperature profile control of a substrate supported on the substrate support in a vacuum chamber of a substrate processing apparatus. The heating plate includes an independently controllable heater zones operable to tune a temperature profile on an upper surface of the heating plate. The heater zones are each powered by two or more power lines wherein each power line is electrically connected to a different group of the heater zones and each respective heater zone is electrically connected to a different pair of power lines.

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