The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Jul. 23, 2010
Vage Oganesian, Palo Alto, CA (US);
Belgacem Haba, Saratoga, CA (US);
Craig Mitchell, San Jose, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Piyush Savalia, San Jose, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Belgacem Haba, Saratoga, CA (US);
Craig Mitchell, San Jose, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Piyush Savalia, San Jose, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A method of fabricating a microelectronic unit includes providing a semiconductor element having a front surface and a rear surface remote from the front surface, forming at least one first opening extending from the rear surface partially through the semiconductor element towards the front surface by directing a jet of fine abrasive particles towards the semiconductor element, and forming at least one conductive contact and at least one conductive interconnect coupled thereto. The semiconductor element can include a plurality of active semiconductor devices therein. The semiconductor element can include a plurality of conductive pads exposed at the front surface. Each conductive interconnect can extend within one or more of the first openings and can be coupled directly or indirectly to at least one of the conductive pads. Each of the conductive contacts can be exposed at the rear surface of the semiconductor element for electrical connection to an external device.