The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Mar. 10, 2015
Applicant:

Indium Corporation, Clinton, NY (US);

Inventors:

Hongwen Zhang, New Hartford, NY (US);

Ning-Cheng Lee, New Hartford, NY (US);

Assignee:

Indium Corporation, Clinton, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/24 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); C22C 12/00 (2006.01); C22C 30/04 (2006.01); C22C 30/02 (2006.01); C22C 30/06 (2006.01); H05K 3/34 (2006.01); B23K 35/362 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/02 (2013.01); B23K 35/0244 (2013.01); B23K 35/24 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/362 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 3/3484 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/29 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/838 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01); H05K 3/3463 (2013.01); Y10T 428/12493 (2015.01);
Abstract

A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.


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