The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Dec. 10, 2012
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chien-Liang Lin, Taoyuan County, TW;

Yu-Ren Wang, Tainan, TW;

Ying-Wei Yen, Miaoli County, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 29/06 (2006.01); H01L 21/441 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/3115 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0603 (2013.01); H01L 21/0234 (2013.01); H01L 21/02164 (2013.01); H01L 21/02332 (2013.01); H01L 21/02337 (2013.01); H01L 21/28202 (2013.01); H01L 21/3105 (2013.01); H01L 21/31155 (2013.01); H01L 21/441 (2013.01); H01L 29/4966 (2013.01); H01L 29/51 (2013.01); H01L 29/513 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01);
Abstract

A semiconductor structure includes a dielectric layer located on a substrate, wherein the dielectric layer includes nitrogen atoms, and the concentration of the nitrogen atoms in the dielectric layer is lower than 5% at a location wherein the distance between this location in the dielectric layer to the substrate is less than 20% of the thickness of the dielectric layer. Moreover, the present invention provides a semiconductor process including the following steps: a dielectric layer is formed on a substrate. Two annealing processes are performed in-situly on the dielectric layer, wherein the two annealing processes have different imported gases and different annealing temperatures.


Find Patent Forward Citations

Loading…