The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Oct. 07, 2015
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Dong Joo Park, Incheon, KR;
Jae Sung Park, Paju-si, KR;
Jin Seong Kim, Goyang-si, KR;
Ju Hoon Yoon, Namyangju-si, KR;
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/92 (2013.01); H01L 25/105 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/294 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.
Quick Actions:
Park, Dong. (2017). Stacked semiconductor package and manufacturing method thereof (U.S. Patent No. 9633966). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9633966
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile