The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jun. 30, 2011
Applicants:

Larry John Dibattista, Cupertino, CA (US);

Duncan Packard Gurley, Cupertino, CA (US);

Inventors:

Larry John Dibattista, Cupertino, CA (US);

Duncan Packard Gurley, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/067 (2006.01); G01R 1/04 (2006.01); G01R 31/3185 (2006.01); H01L 21/66 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0491 (2013.01); G01R 31/318511 (2013.01); G06F 17/5072 (2013.01); H01L 22/32 (2013.01); H01L 2224/16 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed.


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