The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jan. 28, 2015
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

F. Daniel Gealy, Kuna, ID (US);

Vishwanath Bhat, Boise, ID (US);

Cancheepuram V. Srividya, Boise, ID (US);

M. Noel Rocklein, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/51 (2006.01); H01L 49/02 (2006.01); H01L 29/78 (2006.01); C23C 16/455 (2006.01); H01L 21/28 (2006.01); H01L 21/314 (2006.01); H01L 21/316 (2006.01);
U.S. Cl.
CPC ...
H01L 29/517 (2013.01); C23C 16/45529 (2013.01); H01L 21/28194 (2013.01); H01L 21/3141 (2013.01); H01L 21/3142 (2013.01); H01L 21/31641 (2013.01); H01L 21/31645 (2013.01); H01L 28/40 (2013.01); H01L 28/56 (2013.01); H01L 29/78 (2013.01);
Abstract

Graded dielectric layers and methods of fabricating such dielectric layers provide dielectrics in a variety of electronic structures for use in a wide range of electronic devices and systems. In an embodiment, a dielectric layer is graded with respect to a doping profile across the dielectric layer. In an embodiment, a dielectric layer is graded with respect to a crystalline structure profile across the dielectric layer. In an embodiment, a dielectric layer is formed by atomic layer deposition incorporating sequencing techniques to generate a doped dielectric material.


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