The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Aug. 03, 2012
Applicants:

Yoshiaki Kageshima, Chichibu, JP;

Daisuke Muto, Chichibu, JP;

Kenji Momose, Chichibu, JP;

Inventors:

Yoshiaki Kageshima, Chichibu, JP;

Daisuke Muto, Chichibu, JP;

Kenji Momose, Chichibu, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/02 (2006.01); C30B 29/36 (2006.01); C30B 25/10 (2006.01); C30B 25/12 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/02 (2013.01); C23C 16/4401 (2013.01); C30B 25/10 (2013.01); C30B 25/12 (2013.01); C30B 29/36 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01);
Abstract

An epitaxial wafer manufacturing device, including a shield (), which in addition to being removably attached inside a chamber, is arranged in close proximity to the lower surface of a top plate (). The shield has a substrate () having an opening () in the central portion thereof that forces a gas inlet () to face the inside of a reaction space (K), and a thin film () that covers the lower surface of the substrate. The surface of the thin film has the shape of surface irregularities corresponding to fine surface irregularities formed in the lower surface of the substrate. When the shield has undergone thermal deformation as a result of being heated by heating means (), deposits deposited on the lower surface of the shield are inhibited from falling off by the shape of the surface irregularities.


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