The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Dec. 31, 2013
Matthew J. Busche, Santa Clara, CA (US);
Vijay D. Parkhe, San Jose, CA (US);
Wendell Boyd, Jr., Morgan Hill, CA (US);
Senh Thach, Union City, CA (US);
Konstantin Makhratchev, Freemont, CA (US);
Masanori Ono, Chiba, JP;
Matthew J. Busche, Santa Clara, CA (US);
Vijay D. Parkhe, San Jose, CA (US);
Wendell Boyd, Jr., Morgan Hill, CA (US);
Senh Thach, Union City, CA (US);
Konstantin Makhratchev, Freemont, CA (US);
Masanori Ono, Chiba, JP;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.