The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Dec. 08, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Noriyoshi Shimizu, Nagano, JP;

Hiromu Arisaka, Nagano, JP;

Akio Rokugawa, Nagano, JP;

Toshinori Koyama, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/3157 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 23/544 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H01L 23/562 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/2081 (2013.01);
Abstract

A wiring board includes plural terminals, an insulating layer, and recess portions. Each terminal includes a roughened upper surface and a roughened side surface. The insulating layer is formed between the terminals. The upper surfaces of the terminals are exposed. An upper surface of the insulating layer is a concave curved surface. The recess portions are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals.


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