The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Sep. 17, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Toshiaki Kodama, Yamanashi, JP;

Toru Yamauchi, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G05B 2219/37224 (2013.01); G05B 2219/45031 (2013.01); G05B 2219/45178 (2013.01); G05B 2219/49112 (2013.01);
Abstract

An alignment apparatus for aligning a wafer includes a mounting unit, an imaging unit, an elevation unit, and a controlling unit. The control unit outputs a control signal for controlling the elevation unit such that a luminance variation between the outer side and the inner side of the wafer obtained by the imaging unit becomes the same as a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused.


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