The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

May. 08, 2012
Applicants:

Johannes Haas, Vienna, AT;

Josef Haas, Leobendorf, AT;

Karl Haderer, Ziersdorf, AT;

Stefan Jiraschek, Koenigsbrunn, AT;

Juergen Reithner, Schoenberg am Kamp, AT;

Leopold Schiessbuehl, Goellersdorf, AT;

Gerhard Schuhleitner, Limberg, AT;

Inventors:

Johannes Haas, Vienna, AT;

Josef Haas, Leobendorf, AT;

Karl Haderer, Ziersdorf, AT;

Stefan Jiraschek, Koenigsbrunn, AT;

Juergen Reithner, Schoenberg am Kamp, AT;

Leopold Schiessbuehl, Goellersdorf, AT;

Gerhard Schuhleitner, Limberg, AT;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A21C 15/02 (2006.01); B23P 19/04 (2006.01); A23G 9/28 (2006.01); B65G 57/30 (2006.01);
U.S. Cl.
CPC ...
B23P 19/04 (2013.01); A21C 15/02 (2013.01); A23G 9/286 (2013.01); B65G 57/301 (2013.01); Y10T 29/49826 (2015.01);
Abstract

An apparatus and a method produce multi-layered wafer blocks which are filled with a spreading substance such as a cream, for example, in which a first wafer block component is transported along a conveying surface to a stacking area, is lifted there from the conveying surface by a gripping device, a second wafer block component is subsequently or simultaneously transported along the conveying surface to the stacking area, and the first wafer block component is placed and/or pressed onto the second wafer block component from above in a joining process.


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