The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Nov. 17, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Deenesh Padhi, Sunnyvale, CA (US);

Yihong Chen, San Jose, CA (US);

Kelvin Chan, San Ramon, CA (US);

Abhijit Basu Mallick, Fremont, CA (US);

Alexandros T. Demos, Fremont, CA (US);

Mukund Srinivasan, Fremont, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); C23C 16/30 (2006.01); C23C 16/452 (2006.01); C23C 16/455 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); C23C 16/30 (2013.01); C23C 16/452 (2013.01); C23C 16/45523 (2013.01); H01L 21/0228 (2013.01); H01L 21/0234 (2013.01); H01L 21/02178 (2013.01); H01L 21/02274 (2013.01); H01L 21/76834 (2013.01); H01L 23/53295 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Implementations described herein generally relate to the formation of a silicon and aluminum containing layer. Methods described herein can include positioning a substrate in a process region of a process chamber; delivering a process gas to the process region, the process gas comprising an aluminum-containing gas and a silicon-containing gas; activating a reactant gas comprising a nitrogen-containing gas, a hydrogen containing gas, or combinations thereof; delivering the reactant gas to the process gas to create a deposition gas that deposits a silicon and aluminum containing layer on the substrate; and purging the process region. The above elements can be performed one or more times to deposit an etch stop stack.


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