The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Oct. 02, 2014
Applicant:

Toshiba Corporation, Minato-ku, Tokyo, JP;

Inventors:

Jeffrey Craig Ramer, Fremont, CA (US);

Karl Knieriem, Mayward, CA (US);

Assignee:

Toshiba Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/205 (2006.01); H01L 29/778 (2006.01); H01L 29/201 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/20 (2006.01); H01L 29/207 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 29/1029 (2013.01); H01L 29/1075 (2013.01); H01L 29/201 (2013.01); H01L 29/205 (2013.01); H01L 29/66 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/78 (2013.01); H01L 29/2003 (2013.01); H01L 29/207 (2013.01);
Abstract

A method for forming a high electron mobility transistor (HEMT) device with a plurality of alternating layers of one or more undoped gallium nitride (GaN) layers and one or more carbon doped gallium nitride layers (c-GaN), and an HEMT device formed by the method is disclosed. In one embodiment, the method includes forming a channel layer stack on a substrate, the channel layer stack having a plurality of alternating layers of one or more undoped gallium nitride (GaN) layers and one or more carbon doped gallium nitride layers (c-GaN). The method further includes forming a barrier layer on the channel layer stack. In one embodiment, the channel layer stack is formed by growing each of the one or more undoped gallium nitride (GaN) layers in growth conditions that suppress the incorporation of carbon in gallium nitride, and growing each of the one or more carbon doped gallium nitride (c-GaN) layers in growth conditions that promote the incorporation of carbon in gallium nitride.


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