The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Aug. 05, 2013
Applicant:
Mediatek Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
MEDIATEK SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15311 (2013.01);
Abstract
According to an embodiment of the present invention, a chip package is provided. The chip package includes a substrate. A chip is disposed on the substrate. A stiffener is disposed on the substrate. The thermal conductivity of the stiffener is higher than the thermal conductivity of the substrate.