The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Mar. 27, 2014
Applicants:

Rui-fang Shi, Cupertino, CA (US);

Zhian Guo, Fremont, CA (US);

Bing LI, Milpitas, CA (US);

Inventors:

Rui-fang Shi, Cupertino, CA (US);

Zhian Guo, Fremont, CA (US);

Bing Li, Milpitas, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06K 9/46 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/4642 (2013.01); G06K 2209/19 (2013.01);
Abstract

In some embodiments, a method and/or system may include detecting defects in photomasks. The method may include acquiring a first image of a first die. The method may include acquiring a second image of a second die. In some embodiments, the method may include dividing the first and the second image into a number of first and second portions respectively. The method may include reducing one or more differences in sizing of the first and the second portions. In some embodiments, the method may include determining a difference in a function derived from an image intensity between the corresponding first and second portions. The method may include summing the differences in the function between the corresponding first and second portions. The method may include detecting mesoscopic scale defects in the second die.


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