The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2017

Filed:

Jul. 20, 2015
Applicants:

Philip H. Bowles, Gilbert, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Inventors:

Philip H. Bowles, Gilbert, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 7/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 29/66 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
B81B 7/04 (2013.01); B81B 7/0029 (2013.01); B81B 7/0041 (2013.01); B81C 1/0023 (2013.01); B81C 1/00293 (2013.01); H01L 23/10 (2013.01); H01L 29/66007 (2013.01); H01L 29/84 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0145 (2013.01); H01L 2224/11 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.


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