The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Dec. 26, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

David J. Llapitan, Tacoma, WA (US);

Jeffory L. Smalley, East Olympia, WA (US);

Gaurav Chawla, Tempe, AZ (US);

Joshua D Heppner, Chandler, AZ (US);

Vijaykumar Krithivasan, Chandler, AZ (US);

Jonathan W. Thibado, Beaverton, OR (US);

Kuang Liu, Queen Creek, AZ (US);

Gregorio Murtagian, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1084 (2013.01);
Abstract

Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.


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