The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Sep. 19, 2014
Applicants:

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventor:

Gang Mao, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 21/332 (2006.01); H01L 29/165 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/165 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes forming a PMOS region and an NMOS region in a semiconductor substrate, forming dummy gate structures in the PMOS and NMOS regions, and forming a gate hard mask layer overlying top portions and sidewalls of the dummy gate structures. The method includes forming silicon carbon regions embedded in the semiconductor substrate on both sides of the dummy gate structure in the NMOS region, removing the hard mask layer on top of the dummy gate in the NMOS region, and forming silicon germanium regions embedded in the semiconductor substrate on both sides of the dummy gate structure in the PMOS region. After forming the silicon carbon regions and the silicon germanium regions, while retaining the hard mask layer on top of the dummy gates in the PMOS region, performing ion implant to form source/drain regions in the NMOS region and the PMOS region.


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