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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9595504 B1

PDFFull Text
Date of Patent:
Mar. 14, 2017

Filed:

Apr. 06, 2015

Methods and systems for releasably attaching support members to microfeature workpieces

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

David Pratt, Meridian, ID (US);

David R. Hembree, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Perkins Coie LLP

Primary Examiner:

Seahvosh Nikmanesh

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); B32B 7/14 (2006.01); B32B 7/02 (2006.01); B32B 3/30 (2006.01); H05K 13/00 (2006.01); B23B 7/02 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/94 (2013.01); B23B 7/02 (2013.01); B32B 3/30 (2013.01); B32B 7/02 (2013.01); B32B 7/14 (2013.01); H01L 21/78 (2013.01); H01L 24/83 (2013.01); H05K 13/0023 (2013.01); B32B 37/1292 (2013.01); B32B 37/144 (2013.01); H01L 2924/14 (2013.01); Y10T 156/19 (2015.01); Y10T 156/1994 (2015.01); Y10T 428/14 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24521 (2015.01); Y10T 428/24562 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24752 (2015.01); Y10T 428/24802 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24942 (2015.01);
Abstract

Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

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