The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Oct. 29, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Olaf Hohlfeld, Warstein, DE;
Edward Fuergut, Dasing, DE;
Horst Groeninger, Maxhuette-Haidhof, DE;
Juergen Hoegerl, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 29/739 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/72 (2013.01); H01L 23/3107 (2013.01); H01L 23/433 (2013.01); H01L 24/83 (2013.01); H01L 29/7393 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main electrode arranged on a top side, a bottom main electrode arranged on an underside, and a control electrode arranged on the top side. The semiconductor assembly further includes a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element.